Thermoplastic chemical mechanical polishing pad and method of manufacture
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United States of America Patent
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Issued Date -
Jul 13, 2006
app pub date -
Jan 12, 2005
filing date -
Jan 12, 2005
priority date (Note) -
Abandoned
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Abstract
The present invention is directed, in general, to a chemical mechanical polishing pad comprising a closed-cell thermoplastic foam polishing body. The polishing body comprises an ethylene vinyl acetate block copolymer. The ethylene vinyl acetate block copolymer comprises a vinyl acetate content ranging from about 1 to about 18 wt %. The closed-cell thermoplastic foam polishing body also comprises filler particles comprising an average size ranging from about 1 to about 20 microns. Other aspects of the invention comprise a method for manufacturing the above-described chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the chemical mechanical polishing pad.
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