Solder composition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 6, 2006
app pub date -
Mar 17, 2004
filing date -
Jul 3, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a lead-free solder composition having a low coefficient of thermal expansion to reduce the likelihood of thermal shock to a glass substrate. The solder composition includes a granular material added to lead-free solder where the granular material may include fused silica, zirconium oxide, Invar.RTM., or any wettable, lead-free alloy such as 36% weight nickel or 64% weight iron and the solder may include tin, silver and bismuth. When a component is soldered to a glass substrate by the present invention and exposed to a substantial change in climatic temperature the granular material counteracts and adsorbs the stress caused by contraction of the solder, thereby preventing thermal shock to the glass substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully