Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
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United States of America Patent
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Issued Date -
Jun 29, 2006
app pub date -
Jan 20, 2006
filing date -
Oct 8, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, and in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid array package having a flip-chip in a die-down configuration. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a flip-chip in a die-down configuration, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
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