Stacked ball grid array packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Jun 29, 2006
app pub date -
Dec 21, 2005
filing date -
Dec 28, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An arrangement of ball grid array packages includes a flexible circuit board having first and second opposed surfaces defining a central portion to which first and second side portions are flexibly attached. A first package has a first array of solder ball pins attached to the first surface of the circuit board in the central portion thereof. A second package has first and second opposed surfaces and a second array of solder ball pins on the first surface that are attached to the second surface of the circuit board in the central portion thereof. A third array of solder ball pins is provided on each of the side portions on the first surface thereof. The side portions are folded underneath the second package and attached to the second surface thereof, whereby the third array of solder ball pins is oriented for attachment to a motherboard.
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