Hot melt adhesive composition
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United States of America Patent
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Issued Date -
Jun 22, 2006
app pub date -
Dec 16, 2005
filing date -
Dec 17, 2004
priority date (Note) -
Abandoned
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Abstract
A hot melt adhesive composition includes ethylene vinyl acetate copolymer(s) having average vinyl acetate content of from about 10% to about 30%, styrene-ethylene-butylene-styrene block copolymer, tackifying resin, and optionally, a plasticizer or a wax.
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