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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
AMO GRONINGEN B V	VAN SWIETENLAAN 5 GRONINGEN 9728 NX

International Classification(s)

• A61K:PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOS....
• A61F:FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES....

• 2005 Application Filing Year
• A61K Class
• 9209 Applications Filed
• 3991 Patents Issued To-Date
• 43.34 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Deuring, Hendrik	Assen, NL	2	143
# of filed Patents : 2 Total Citations : 143
Haitjema, Hendriek Jan	At Petze, NL	1	44
# of filed Patents : 1 Total Citations : 44

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Patent Citation Ranking

• 44 Citation Count
• A61K Class

• 93.66 % this patent is cited more than
• 19 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2015/0348,935

Method of Temporarily Attaching a Rigid Carrier to a Substrate

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Abstract

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Method for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid carrier with the sacrificial layer positioned therebetween. Electronic components and/or circuits may then be fabricated or other semiconductor processing steps employed (e.g., backgrinding) on the attached substrate. Once fabrication is completed, the substrate may be detached from the rigid carrier by heating the assembly to decompose the sacrificial layer.

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Description

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