Method for forming hermetic glass bead assembly having high frequency compensation
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United States of America Patent
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Issued Date -
Jun 22, 2006
app pub date -
Jan 10, 2006
filing date -
Mar 1, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Methods and devices in accordance with the present invention can comprise forming an electrical feed-through assembly to provide a hermetic seal in a coaxial connector. In one embodiment, the electrical feed-through assembly comprises a conductive insert having a bore, a dielectric insert positioned within the bore having a first diameter sized such that an impedance of the dielectric insert is a target impedance, the dielectric insert having a center conductive pin extending there-through, and an air dielectric positioned within the bore, the air dielectric having a second diameter sized such that an impedance of the air dielectric is the target impedance, a portion of the air dielectric extending into the dielectric insert, wherein the portion of the air dielectric extending into the dielectric insert is a compensation gap.
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