Method of forming a conductive metal region on a substrate
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United States of America Patent
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Issued Date -
Jun 22, 2006
app pub date -
Jan 28, 2004
filing date -
Jan 28, 2003
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Abstract
There is disclosed a method of forming a conductive metal region on a substrate, comprising depositing on the substrate a solution of a metal ion, and depositing on the substrate a solution of a reducing agent, such that the metal ion and the reducing agent react together in a reaction solution to form a conductive metal region on the substrate.
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