Flip chip device
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United States of America Patent
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app pub date -
Mar 31, 2005
filing date -
Dec 14, 2004
priority date (Note) -
Abandoned
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Abstract
A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, a plurality of chips having surfaces with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chips for electrically connecting the chips and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By changing the position of the compliant bumps so that they are centrally disposed on the chips without changing the electrical characteristics and the wiring arrangement of the chips, costs are lowered, reliability is increased and the glass substrate is less easily bent.
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