Dressing method for polishing pad

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20060121837A1
SERIAL NO

11195722

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Abstract

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The present invention provides a dressing method for a polishing pad in a polishing apparatus which performs work with a work piece contacting a polishing pad while supplying a slurry, comprising the steps of performing dressing of the polishing pad by pressing a pad dresser against the polishing pad and performing dressing of the polishing pad by making a cleaning fluid fog drops each with a droplet grain size of 1 .mu.m to 500 .mu.m inclusive and spouting the fog drops to the polishing pad from a nozzle at a speed of 10 m/second to 500 m/second inclusive.

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Patent Owner(s)

Patent OwnerAddress
ASAHI SUNAC CORPORATIONOWARIASAHI-SHI ASAHI-KEN 488-8688

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Seike, Yoshiyuki Owariasahi-shi, JP 6 13

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