Electroless plating of piezoelectric ceramic
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United States of America Patent
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Issued Date -
Jun 8, 2006
app pub date -
Nov 29, 2004
filing date -
Nov 29, 2003
priority date (Note) -
Abandoned
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Abstract
Methods of electroless plating piezoelectric ceramic with copper metal, include contacting a copper halide salt with an electroless plating solution to form a mixture and contacting the piezoelectric ceramic with the mixture.
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