LIGHT EMITTING DIODE PACKAGE
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United States of America Patent
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Issued Date -
Jun 8, 2006
app pub date -
Mar 24, 2005
filing date -
Dec 2, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A light emitting diode (LED) package including a chip carrier, an adhesive layer, a light emitting diode (LED) chip and an anti-aging layer is provided. The adhesive is disposed on the chip carrier. The LED chip having a light emitting layer is adhered on the chip carrier by the adhesive layer, and is electrically connected with the chip carrier. The anti-aging layer is disposed between the adhesive and the chip carrier. In the LED package described above, the light emitted from the LED being illuminated on the adhesive layer is reduced or prevented by the anti-aging layer. Therefore, the aging phenomenon of the LED package is retarded, and the lifetime of the LED package is further enhanced.
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