SPUTTERED TRANSPARENT CONDUCTIVE FILMS
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United States of America Patent
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Issued Date -
Jun 8, 2006
app pub date -
Dec 8, 2005
filing date -
Dec 8, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A hollow cathode sputtering apparatus and related method for introducing dopants into a sputtered coating is provided. The method utilizes a sputter reactor which includes a cathode channel that allows a gas stream to flow therein and a flow exit end from which gases may flow out of and towards a substrate to be coated. The cathode channel as used in the invention is defined by a channel defining surface that includes at least one target material. The sputter reactor further includes a dopant target positioned to provide dopant atoms to the gas stream when the gas stream is flowed through the cathode channel.
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