Method of producing a mask blank for photolithographic applications, and mask blank
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United States of America Patent
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Issued Date -
Jun 1, 2006
app pub date -
Aug 8, 2005
filing date -
Aug 6, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a method of producing a mask blank (1) for photolithographic applications, particularly in EUV lithography, comprising the steps of: providing a substrate (2) which has a front side (4) and a rear side (3); depositing an electrically conductive layer (5) on the rear side of the substrate; depositing a coating on the front side of the substrate, wherein the coating comprises at least a first layer (6) and a second layer (9); and structuring the coating (6, 9) for photolithographic applications; wherein a respective handling area (22; 22a-22c) is formed on the front side (4) at least at one predefined location, said handling area not being structured for photolithographic applications and being designed for the handling of the mask blank (1) by means of a mechanical clamp or handling device, and wherein the first layer (6) is exposed in the respective handling area (22; 22a-22c) so that, when the mask blank (1) is handled from the front side, the mechanical clamp or handling device bears against the first layer (6). The invention furthermore relates to a corresponding mask blank.
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