Method of producing porous low dielectric thin film
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United States of America Patent
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Issued Date -
Jun 1, 2006
app pub date -
Dec 1, 2005
filing date -
Dec 1, 2004
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Abstract
A method of producing a porous low dielectric thin film is provided. The method comprises conducting hydrolysis and polycondensation of a polyreactive cyclic siloxane compound alone or in conjunction with one or more types of linear siloxane compounds or in conjunction with a Si monomer having an organic leg in the presence of water, organic hydroxide, and an organic solvent to produce a siloxane-based polymer, dissolving the polymer in water or the organic solvent to produce a coating solution, applying the coating solution on a substrate, and heat curing the resulting substrate. Even though a pore forming material is not used, it is possible to produce a porous low dielectric thin film.
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