Near neutral pH tin electroplating solution
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United States of America Patent
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Issued Date -
Jun 1, 2006
app pub date -
Nov 21, 2005
filing date -
Nov 29, 2004
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a solution for use in connection with the deposition of tin or tin alloys on platable portions of substrates. This solution comprises water; tin ions in an amount sufficient to provide a tin deposit on platable portions of substrates; a complexing agent of an acid or salt thereof that is stable at a pH of above 5.5 and below 10 present in an amount sufficient to render the metal ion soluble in the solution; and a surfactant of an alkoxylated polyalcohol present in an amount sufficient to complex the metal and render it soluble in the solution to facilitate deposition of tin upon the platable portions of the substrates.
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