Method of forming conductive pattern
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United States of America Patent
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Issued Date -
May 25, 2006
app pub date -
Oct 21, 2005
filing date -
Nov 25, 2004
priority date (Note) -
Abandoned
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Abstract
A method of forming a conductive pattern includes a step of forming a bank on a substrate and a step of applying a lyophobic agent to a part or whole of an upper face of the bank.
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