Multi-chip package and method of fabricating the same
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United States of America Patent
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app pub date -
Oct 28, 2005
filing date -
Oct 29, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A lower chip is fixed to a surface of an interposer by flip-chip bonding with an under fill acting as an adhesive applied to the surface. A lifted pad having a height of approximately 10 .mu.m is provided on the surface of the interposer. A bonding wire connects the lifted pad and a bonding pad provided on a surface of an upper chip. A stick-out portion of the under fill at the time of fixing the lower chip to the interposer is dammed by the lifted portion of the lifted pad. This prevents the stick-out portion of the under fill from covering the top of the lifted pad.
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