High watt density thermoelectrics
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United States of America Patent
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Issued Date -
May 25, 2006
app pub date -
Nov 24, 2004
filing date -
Nov 24, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In accordance with one embodiment of the present invention, a method of manufacturing a thermoelectric device is disclosed. The method includes forming a wafer of thermoelectric material and coupling the wafer to a stiff backing such that a bottom side of the wafer faces the stiff backing and a top side of the wafer faces away from the stiff backing. The method also includes reducing a thickness of the wafer by removing a portion of the wafer from the top side, and dicing the wafer into a plurality of blocks. At least a portion of the plurality of blocks are then coupled with a permanent substrate.
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