Method of making a printed circuit board
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United States of America Patent
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N/A
Issued Date -
May 25, 2006
app pub date -
Nov 24, 2004
filing date -
Nov 24, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
a method of making a printed circuit board including the steps of: providing a board with electrical conductor traces; applying a solder material to at least one selected location on a first side of the board; placing a first component on the first side of the board; heating the board and solder material to reflow the solder applied to the first side of the board to provide an electrical connection of the first component with a first conductor trace portion of the board; and then connecting a second component to the board and providing a nonsoldered electrical connection between the second component and a second electrical conductor trace portion of the board.
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