New process for preparing polyimide
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 18, 2006
app pub date -
Jan 27, 2005
filing date -
Nov 12, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a novel process for preparing polyimide, which comprises: reacting a di-anhydride with diamine to form polyamic acid, applying or casting the polyamic acid on a substrate, evaporating the solvent contain therein to control the volatile content in the resulting polyamic acid at not more than 10 wt %, rewinding the polyamic acid-coated substrate at a tensile strength of not more than 20 kgf/cm.sup.2, transferring into an oven, heating the coated substrate at a gradient temperature to cyclize the polyamic acid into polyamide, to obtain a flexible laminate having excellent appearance in good yield. According to the present process, a polyimide flexible film having excellent properties can be produced in a low cost and a high yield.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully