Importance

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Abstract

High performance integrated circuits generally have high heat generating capabilities. During powering up of these integrated circuits under typical operating conditions, heat generation is unavoidably accelerated. When the accumulated heat is not adequately dissipated, the high temperature of the integrated circuits will lead to overheating which in turn, causes irreversible damage to the integrated circuits. Conventional thermal management methods using bumps of a ball grid array (BGA) as heat paths to a heat sink has low thermal transmissibility due to the substantially spherical shape thereof. Metallic columns formed by vias in substrates have dimensional restrictions that also limit thermal transmissibility thereof. Coupling of semiconductor device directly to a heat sink formed in a substrate will also require undesirable structural modifications to the substrate, for example a concavity formed therein, for accommodating the integrated circuit therewithin. Embodiments of the invention describe a heat sinking structure comprising: a carrier having a circuitry formed integral therewith; a substrate having a thermal conductor formed integral therewith; a heat sink thermally communicating with the thermal conductor of the substrate; and a pillar extending from the carrier to the substrate for structurally intercoupling and spatially interdisplacing the carrier and the substrate, the pillar for thermally coupling the carrier to the thermal conductor of the substrate such that heat generated by the circuitry is conveyed therefrom to the thermal conductor via the pillar, and that the thermal conductor conveys heat received thereby to the heat sink.

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First Claim