Method of implanting at least one solder bump on a printed circuit board
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United States of America Patent
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Issued Date -
May 11, 2006
app pub date -
Oct 26, 2004
filing date -
Oct 26, 2004
priority date (Note) -
Abandoned
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Abstract
A method of implanting at least one solder bump on a surface of a printed circuit board (PCB) on which at least one soldering pad is exposed since the solder bump intended to be formed thereon is missing is described. The method comprises the steps of: first, forming at least one solder bump for mating with its exposed soldering pad. Then, coating a layer of flux on the surface of the PCB and the exposed soldering pad. Transplanting the solder bump onto the exposed soldering pad. Finally, reflowing the solder bump and clearing the layer of flux from the PCB. In this manner, the solder bump is made up for on the PCB.
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