Method and apparatus for applying powder in a pattern to a substrate
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United States of America Patent
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Issued Date -
May 11, 2006
app pub date -
Sep 11, 2003
filing date -
Sep 13, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and apparatus for providing a pattern on a solid dosage form, in which powder material is applied in a pattern to a substrate. A mask having an aperture is provided between a source of the powder material and the substrate and the powder material is applied to the substrate through the mask. Relative movement of the substrate with respect to the source of powder material is effected during the pattern application process.
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