Lens module structure
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United States of America Patent
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Issued Date -
May 11, 2006
app pub date -
Nov 10, 2004
filing date -
Nov 10, 2004
priority date (Note) -
Abandoned
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Abstract
A lens module structure includes an image sensing chip disposed on the first side of a substrate and electrically coupled to the substrate through wires. A memory chip and a control chip are soldered onto a second surface of the substrate, and a solderable output unit terminal is provided on one side of the second surface of the substrate for connecting to other electronic components. A lens pedestal is fastened onto the first surface of the substrate such that the image sensing chip is encapsulated within the lens pedestal, and an optical lens is provided within the lens pedestal and corresponding to the image sensing chip. In such way, the assembled components of the lens are decreased and the chips thereof are designed in a modular mode such that the overall volume of the lens is reduced and the surface mounting technologies can be omitted.
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