Apparatus for depositing thin film on wafer
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United States of America Patent
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Issued Date -
May 11, 2006
app pub date -
Nov 2, 2005
filing date -
Nov 6, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A thin film deposition apparatus that can effectively use a chemical source having a high vaporization temperature is provided. The thin film deposition apparatus includes a chamber for depositing a thin film on a wafer, a canister for accommodating a liquid chemical source to be supplied to the chamber, and a vaporizer for vaporizing the liquid chemical source bubbled in the canister and providing the vaporized chemical source to the chamber. The vaporizer is installed on a top surface or lateral surface of the chamber by an adaptor block to be incorporated into the chamber. A first gas line between the vaporizer and the chamber is formed within the adaptor block.
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