Thin ply laminates
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United States of America Patent
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Issued Date -
May 4, 2006
app pub date -
Sep 23, 2005
filing date -
Sep 24, 2004
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Abstract
Fiber composite materials using thin plies with a thickness of less than 0.08 mm provide improved delamination resistance and thinner minimum gauge for laminates. Thin plies may be hybridized with conventional plies, interlaced for strength, and used with adhesives as reinforcement in bonding.
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