Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment
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United States of America Patent
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Issued Date -
Apr 27, 2006
app pub date -
Oct 7, 2005
filing date -
Oct 26, 2004
priority date (Note) -
Abandoned
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Abstract
A method of forming a conductive pattern having superior conductivity and better adhesion with a substrate is provided, thereby enabling a thick conductive pattern to be formed. The method comprises the steps of preparing a substrate, forming a metallic core containing metallic particles on the substrate by a droplet ejecting method so that the metallic core has a pattern substantially the same as the predetermined conductive pattern, and forming a plating layer so as to cover the surface of the metallic core by carrying out at least one electroless plating to thereby obtain the conductive pattern. A wiring substrate having the conductive pattern formed by the method, an electronic device provided with the wiring substrate and electronic equipment provided with the electronic device are also provided.
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