Sandwiched thermal solution
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United States of America Patent
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Sep 21, 2010
Grant Date -
Apr 27, 2006
app pub date -
Oct 6, 2004
filing date -
Oct 6, 2004
priority date (Note) -
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Abstract
A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
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