Aqueous slurry composition for chemical mechanical planarization
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United States of America Patent
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Issued Date -
Apr 27, 2006
app pub date -
Oct 26, 2005
filing date -
Oct 26, 2004
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Abandoned
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Abstract
An aqueous slurry composition of the present invention, comprising a first polyacrylic acid and a second polyacrylic acid having specific weight average molecular weights ranging from 1,000,000 to 3,000,000 and from 2,000,000 to 8,000,000, respectively, in combination with a metal oxide abrasive, can perform highly efficient chemical mechanical planarization (CMP) of a layer formed during the manufacturing process of a multi-layered semiconductor device.
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