Porous organosilicates with improved mechanical properties
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United States of America Patent
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Jun 12, 2007
Grant Date -
Apr 20, 2006
app pub date -
Jan 7, 2005
filing date -
Oct 18, 2004
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Abstract
Oxycarbosilane materials make excellent matrix materials for the formation of porous low-k materials using incorporated pore generators(porogens). The elastic modulus numbers measured for porous samples prepared in this fashion are 3 6 times higher than porous organosilicates prepared using the sacrificial porogen route. The oxycarbosilane materials are used to produce integrated circuits for use in electronics devices.
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