MMC memory card with TSOP package
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United States of America Patent
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N/A
Issued Date -
Apr 20, 2006
app pub date -
Oct 14, 2004
filing date -
Oct 14, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The MMC memory card with TSOP package includes a circuit board with a plurality of passive elements and ICs installed thereon and a plastic housing is covered over and enclosing the circuit board to form a memory card structure. At least one flash memory of the ICs is used with a TSOP package and the housing has a space to position the TSOP type flash memory such that said TSOP type flash memory is assembled with the housing and the total thickness of the assembly meets the requirement of the standard specification.
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