Connection structure of high frequency lines and optical transmission module using the connection structure

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United States of America Patent

SERIAL NO

11240455

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Abstract

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A connection structure is applied to mutually connect a first and a second transmission line that is planar in shape and that has a ground conductor on a second main surface, such as a microstrip line or a coplanar line with a ground. The first and the second transmission lines are superposed one upon the other, and their signal wiring patterns are electrically connected, as are their ground conductors. An end surface of the first transmission line is substantially covered by a conductor layer connected to the ground conductor. The connection structure can achieve good signal transmission characteristics up to high-frequency bands on the order of several tens of gigahertz.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTD6 KANDA SURUGADAI 4-CHOME CHIYODA-KU TOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akashi, Mitsuo Chigasaki, JP 12 38
Oomae, Shigeo Hadano, JP 6 47
Saito, Tatsuya Kunitachi, JP 165 2057
Yagyu, Masayoshi Hanno, JP 26 667

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