Desoldering wick for lead-free solder
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United States of America Patent
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Issued Date -
Apr 20, 2006
app pub date -
Oct 14, 2004
filing date -
Oct 14, 2004
priority date (Note) -
Abandoned
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Abstract
A desoldering wick having an inner metal coating such as a 0.1 .mu.m to 12 .mu.m layer of tin or tin-alloy and an outer noble metal coating such as a 0.5 nm to 10 .mu.m layer of gold, silver, platinum, palladium, or rhodium for the removal of lead-free solder; a method of manufacturing the desoldering wick; and methods of using the wick.
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