Pressure-punch device for film welding
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United States of America Patent
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Oct 23, 2007
Grant Date -
Apr 20, 2006
app pub date -
Feb 12, 2004
filing date -
Feb 18, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a pressure stamp device for the sealing of films with a slidable stamp element with a stamping surface for applying pressure to a first foil to bond it to a supported second foil, a substantially homogeneous internal temperature distribution is reached by contributing the stamping element with multiple layers so that it includes basically three layers with a heated central layer of a first material with a thermal conductivity and two peripheral layers of a second material flanking it, the surface being formed by one of the peripheral layers to constitute the stamping surface.
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