Systems and methods for magnetron deposition
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United States of America Patent
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Issued Date -
Apr 20, 2006
app pub date -
Oct 15, 2004
filing date -
Oct 15, 2004
priority date (Note) -
Abandoned
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Abstract
Systems and methods are disclosed for face target sputtering to fabricate semiconductors by an air-tight chamber in which an inert gas is admittable and exhaustible; a first cylindrical target plate; inner and outer cylindrical magnets respectively disposed adjacent to the cylindrical target plate such that magnet poles of different polarities face each other across said plasma region thereby to establish a magnetic field covering the target plate; and a substrate holder adapted to hold a substrate on which an alloyed thin film is to be deposited.
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