Backing plates for sputtering targets
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Apr 20, 2006
app pub date -
Oct 6, 2005
filing date -
Oct 19, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A backing plate for sputtering targets contains an aluminum alloy having an average coefficient of linear expansion of 23.0.times.10.sup.-6/.degree. C. or less at temperatures of 25.degree. C. to 100.degree. C. This backing plate prevents warp occurring upon bonding with a target, reduces stress occurring upon film deposition (sputtering) of Al--Nd alloy thin films, saves the flattening process of the warp, is reduced in cracking of a brazing filler metal arranged between the target and the backing plate and thereby enables stable film deposition operation over a long period of time.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully