Flexible circuit board processing method
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United States of America Patent
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app pub date -
Oct 13, 2005
filing date -
Oct 13, 2004
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Abandoned
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Abstract
It is an object of this invention to provide a flexible circuit board processing method which controls an outflow of a sealing material to be appropriate when packaging a component on a flexible circuit board. There is provided a flexible circuit board processing method for, when packaging a chip component (10) on a flexible circuit board, filling the surroundings of the chip component in a component-mounting portion on the board with a sealing material (20), wherein a surface (A) of the component-mounting portion is subjected in advance to a modification process to improve the wettability to the sealing material.
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