Low expansion dielectric compositions
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United States of America Patent
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Issued Date -
Apr 6, 2006
app pub date -
Sep 28, 2004
filing date -
Sep 28, 2004
priority date (Note) -
Abandoned
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Abstract
Dielectric compositions comprising a first component and a second component present at about 5 parts to about 60 parts filler per 100 parts of the first component are disclosed. In certain examples, the first component includes a polyphenylene ether, a polyepoxide, and optionally a compatibilizing agent and a catalyst. Certain examples of the dielectric compositions disclosed herein have low coefficients of thermal expansion. Prepregs, laminates, molded articles and printed circuit boards using the dielectric compositions are also disclosed.
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