Laser weldable resin composition and composite article
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Apr 6, 2006
app pub date -
Sep 29, 2005
filing date -
Oct 1, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In a method for improving bonding strength between a first resin article and a second resin article, the method comprises using a compatibilizer for both a first thermoplastic resin and a second thermoplastic resin, wherein the first resin article is formed from a first resin composition comprising a first thermoplastic resin, and the second resin article is formed from a second thermoplastic resin or a second resin composition comprising a second thermoplastic resin, and at least the first resin composition out of the first and the second resin compositions comprises the compatibilizer, wherein the first and the second resin articles are welded to each other by laser irradiation to form a composite article.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
JP | A | JP2006312303 | Sep 12, 2005 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
Published unexamined patent application | LASER BEAM WELDING RESIN COMPOSITION AND COMPOSITE MOLDING | Nov 16, 2006 | |||
EP | A1 | EP1642701 | Sep 26, 2005 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION PUBLISHED WITH SEARCH REPORT | Laser weldable resin composition and composite article obtained from said composition | Apr 05, 2006 | |||
CN | A | CN1760272 | Sep 29, 2005 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED APPLICATION FOR A PATENT FOR INV. | Laser weldable resin composition and composite article | Apr 19, 2006 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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DAICEL POLYMER LTD | TOKYO 108-8231 |
International Classification(s)

- 2005 Application Filing Year
- B32B Class
- 3530 Applications Filed
- 1682 Patents Issued To-Date
- 47.65 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Itakura, Masahiko | Minato-ku, JP | 15 | 47 |
# of filed Patents : 15 Total Citations : 47 | |||
Ooe, Yuichi | Sakai-shi, JP | 2 | 28 |
# of filed Patents : 2 Total Citations : 28 |
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Patent Citation Ranking
- 1 Citation Count
- B32B Class
- 3.09 % this patent is cited more than
- 19 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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