Positive photosensitive resin and novel dithiol compound
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United States of America Patent
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Issued Date -
Mar 30, 2006
app pub date -
Sep 26, 2005
filing date -
Sep 27, 2004
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Abandoned
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Abstract
A positive photosensitive resin having, in the high-molecular main chain, a structure represented by the following general formula (1): and a dithiol compound represented by the following general formula (2): The positive photosensitive resin can alleviate the problems of conventional technique and, when used for formation of a fine patter in semiconductor production, can show a higher resist sensitivity than conventional products and can bring about effects such as reduction in impurities after development. The dithiol compound is novel and extremely suitable for use in production of the positive photosensitive resin.
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