Alloy composition and plating method

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United States of America Patent

SERIAL NO

11265382

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of lead on substrates and uses for such plated substrates.

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Patent Owner(s)

Patent OwnerAddress
SHIPLEY COMPANY L L CMARLBOROUGH MA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Neil D Merrick, NY 22 209
Crosby, Jeffrey N Derbyshire, GB 15 122
Martin, James L Merrick, NY 43 913
Schetty, Robert A III Fort Salonga, NY 13 91
Toben, Michael P Smithtown, NY 33 322
Whitlaw, Keith J Derbyshire, GB 5 40

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