CMP process endpoint detection method by monitoring and analyzing vibration data
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United States of America Patent
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Issued Date -
Mar 23, 2006
app pub date -
Sep 20, 2004
filing date -
Sep 20, 2004
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Abandoned
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Abstract
An apparatus and method for monitoring vibration of a chemical-mechanical planarization (CMP) tool to detect CMP process endpoint. In one embodiment, the CMP tool includes a wafer carrier configured to directly or indirectly receive a semiconductor wafer. The carrier rotates the semiconductor wafer with respect to a polishing pad. It is noted that the polishing pad can also be rotated. An accelerometer is attached to the CMP tool and is configured to generate an electrical signal, wherein the electrical signal is being generated as a function of vibration within the CMP tool. A spectrum analyzer is coupled to the accelerometer and is configured to receive the electrical signal. The spectral analyzer generates a frequency spectrum as a function of the electrical signal. A computer system may be used to monitor one or more frequency components of the frequency spectrum. The computer system can be programmed to detect a predetermined change in one or more frequency components of the frequency spectrum that is indicative of CMP process endpoint. In one embodiment, the spectrum analyzer and computer system may be the same machine.
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