Circuit arrangement for cooling of surface mounted semi-conductors
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United States of America Patent
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N/A
Issued Date -
Mar 23, 2006
app pub date -
Sep 16, 2005
filing date -
Sep 20, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A circuit arrangement comprises a circuit board (10), a semi-conductor (12) provided on a first side of the circuit board, and a heat sink (15) provided on a second side of the circuit board opposite to the first side and in heat transferring contact with the power semi-conductor. A heat conductive element (13) is provided in a hole (10a) in the circuit board, wherein the heat conductive element is positioned in heat transferring contact with both the semi-conductor and the heat sink for transfer of heat generated by the semi-conductor to the heat sink. A circuit arrangement is provided, wherein the provision of a low thermal resistance path through the circuit board by means of heat conductive elements provides a compact circuit arrangement well suited for assembly by means of an automated surface mounting process.
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