Importance

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Abstract

As the functionality, speed and portability of consumer electronics increases, so does the need for more circuitry to be packed into smaller spaces. All this leads to the fact that the size of a device is now becoming more often a function of the circuit board or module size than anything else. In order to achieve size reduction of multi-featured products, passive components on the surface of the circuit need to be eliminated by burying them within the inner layers of the printed wiring board. Embedded passives are passive components placed between the interconnecting substrates of a printed wiring board. Implementation of embedded passives reduces space requirements and enables more silicon devices to be placed on the same sized substrate, thereby allowing functional potential of small electronic devices to increase. However, additional steps are conventionally required for embedding passive components within the interconnect layer between substrates. An embodiment of the invention discloses an embedded passive component comprising electrically conductive pillars formed on a substrate. One portion of the pillars functions as a passive structure and another portion of the pillars functions as inter-displacement means. As only pillars are used, steps for forming the embedded passive component are simplified and quantitatively reduced.

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First Claim