High temperature functioning stripper for cured difficult to remove photoresist coatings
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United States of America Patent
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Issued Date -
Mar 2, 2006
app pub date -
Aug 31, 2004
filing date -
Aug 31, 2004
priority date (Note) -
Abandoned
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Abstract
A chemical stripping solvent composition is provided for removing cured polymeric isoprene from inorganic substrates comprising normal and isoparaffins exhibiting a high flash point and a sulfonic acid dissolving system. The stripping composition comprises a blend of chemistries, designed to operate at high temperature processing conditions without attack to sensitive metals. The invention will remove fully cured negative-tone isoprene-based photoresist at temperatures equal to or beyond 100.degree. C. Isoprene polymer in the presence of certain cross-linking photoinitiators will cure to a smooth rubber and highly chemically resistant framework. This material is used to produce patterns, which become the basis for depositing microcircuits in semiconductor manufacturing. Upon exposure to the invention, the cured polymer will begin to breakdown, allowing the residue to be rinsed away with IPA or water. A corrosion inhibitor that is proven to be high temperature stable is added to protect metals. Removal rates vary depending upon the thickness of the resist and the condition which it was exposed during the process. Heat and agitation will improve the removal process.
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