Machining apparatus and methods
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Mar 2, 2006
app pub date -
May 27, 2003
filing date -
May 31, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A machining spindle comprising an inner shaft (110a) arranged for carrying a first tool (5a) for machining a work-piece and an outer shaft (110b) arranged for carrying a second tool (5b) for machining the workpiece, wherein the shafts are mounted one inside the other for rotation about a common axis and for axial movement relative to each other. The shafts are supported by air bearings. The spindle is particularly suited to dicing silicon wafers into oblong chips.
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