Importance

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Abstract

Apparatus and methods are provided that facilitate installation and removal of integrated circuits ('IC') and other components from a heat sink in consumer electronics systems. Preferably, a clip is provided pre-fastened at one end to a heat sink. The other unfastened end of the clip is adapted to be releasably latched in place on the heat sink to retain the IC or other component needing heat dissipation in place once it has been positioned against the heat sink as desired. Preferably, the clip comprises a thin spring-like body including an upper cross member extending between first and second legs, which extend generally orthogonally from the cross member. The cross-member preferably curves inwardly toward the space between the legs and presses against the IC or other component with a spring-like force to ensure good thermal transfer from the IC or other component to the heat sink. The second leg is preferably adapted to releasably engage a slot or other receptacle formed in the body of the heat sink. Extending outwardly generally orthogonally from the fixed leg is a mounting base to secure or pre-fasten one end of the clip to the heat sink. Alternatively, the clip may be integrally formed with the heat sink with the fixed leg extending from-the heat sink.

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First Claim