Integrated system for processing semiconductor wafers
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United States of America Patent
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app pub date -
Oct 11, 2005
filing date -
Jan 5, 2001
priority date (Note) -
Abandoned
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Abstract
An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem includes a process chamber and a cleaning chamber. The system also has a wafer handling subsystem for transporting each of the wafers into or out of the appropriate one of the plurality of processing subsystems. The plurality of processing subsystems and wafer handling subsystem form an integrated system.
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