Method of manufacturing polishing slurry for use in precise polishing process

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20060032148A1
SERIAL NO

11192364

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An abrasive and a dispersion medium are introduced into a dispersing machine to uniformly disperse the abrasive. The liquid to be processed after dispersion is centrifugally classified by a centrifugal classifier to remove heavy particles which will cause scratches. Chemicals are added to the liquid to be processed after classification to make adjustments on a variety of properties such as the concentration, pH, and the like. The polishing slurry after adjustment for a desired composition is filtered by a filter to remove debris therefrom. The filter may have a mesh size large enough to allow particles of the abrasive to pass therethrough.

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Patent Owner(s)

Patent OwnerAddress
NEC ELECTRONICS CORPORATIONKAWASAKI KANAGAWA 211-8668
TOKYO MAGNETIC PRINTING CO LTDMINATO-KU 5-1 TAITO 1-CHOME TAITO-KU TOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kaku, Tomohiro Tokyo, JP 24 169
Kunugi, Takaharu Kawasaki, JP 5 13
Sasakura, Takanori Tokyo, JP 1 1

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